>>>>>型號:IS200VVIBH1CAC 印刷電路板 振動監(jiān)測板 連接到端子板
【功能描述】
IS200VVIBH1CAC是GE為Mark VI系統(tǒng)制造的印刷電路板。Mark VI是GE以“Speedtronic”名稱發(fā)布的幾種燃?xì)廨啓C和蒸汽輪機管理系統(tǒng)之一。
該IS200VVIBH1CAC用作振動監(jiān)測板。該PCB處理來自DVIB或TVIB端子板的振動探頭信號。這些探頭直接連接到端子板。一塊板最多可以連接14個探頭。IS200VVIBH1CAC將這些信號數(shù)字化，并通過VME總線將其發(fā)送到控制器。振動探頭用于四種保護(hù)功能，包括：
振動。
轉(zhuǎn)子偏心率。
差分?jǐn)U展。
轉(zhuǎn)子軸向位置
連接到IS200VVIBH1CAC的端子板支持本特利內(nèi)華達(dá)提供的類型的地震探頭、近測探頭、速度計探頭和加速度計探頭。在單工或TMR模式下，這些探頭的電源均來自IS200VVIBH1CAC板。
IS200VVIBH1CAC包括一個帶有三個 LED 指示燈的面板。它們被標(biāo)記為失敗、狀態(tài)和運行。面板使用三個螺釘連接到PCB表面。該板有兩個背板連接器，標(biāo)記為 P1 和 P2。該板還有四個額外的連接器。該板有幾排電感線圈/磁珠，位于 P2 背板的正后方并平行于此，標(biāo)記為 L1 至 L55。該板還帶有各種二極管、電容器和電阻器。組件位于兩個電路板表面上。集成電路（超過50個）包括Xilinx Spartan現(xiàn)場可編程門陣列（FPGA）以及多種類型的RAM和SRAM芯片。該組件的技術(shù)支持由GE提供。有關(guān)更多信息，請參閱MKVI控制系統(tǒng)指南，包括警報、故障代碼和可能的原因列表。
>>>>>型號:IS200VVIBH1CAC 印刷電路板 振動監(jiān)測板 連接到端子板
【英文介紹】
IS200VVIBH1CAC is a printed circuit board manufactured by GE for the Mark VI system. The Mark VI is one of several gas turbine and steam turbine management systems released by GE under the name Speedtronic.
The IS200VVIBH1CAC is used as a vibration monitoring board. The PCB processes vibration probe signals from DVIB or TVIB terminal boards. These probes are connected directly to the terminal plate. Up to 14 probes can be connected to one board. The IS200VVIBH1CAC digitizes these signals and sends them to the controller via the VME bus. The vibration probe is used for four protection functions, including:
Vibrations.
Rotor eccentricity.
Differential expansion.
Rotor axial position
The terminal board connected to the IS200VVIBH1CAC supports the types of seismic probes, proximity probes, speedometer probes, and accelerometer probes supplied by Bentley Nevada. In simplex or TMR mode, these probes are powered by the IS200VVIBH1CAC board.
The IS200VVIBH1CAC includes a panel with three LED indicators. They are marked as failed, status, and Run. The panel is attached to the PCB surface using three screws. The board has two backplane connectors, labeled P1 and P2. The board also has four additional connectors. The board has several rows of inductors/beads located directly behind and parallel to the P2 backplane, labeled L1 to L55. The board also has a variety of diodes, capacitors and resistors. The components are located on two board surfaces. Integrated circuits (more than 50) include Xilinx Spartan field programmable gate arrays (FPgas) as well as multiple types of RAM and SRAM chips. The technical support for this component is provided by GE. For more information, see the MKVI Control System Guide, including alerts, fault codes, and a list of possible causes.
>>>>>型號:IS200VVIBH1CAC 印刷電路板 振動監(jiān)測板 連接到端子板
