TMPU-1002

這是一種高純度的二氧化鈦（TiO2）材料，主要用于沉積薄膜，特別是在半導體制造、光學器件和磁性器件等領域有廣泛應用。該產(chǎn)品具有高純度、良好的均勻性和長使用壽命等特點。

磁控濺射靶材料在半導體制造中的應用主要包括以下幾個方面：

晶圓制造：靶材在晶圓制造環(huán)節(jié)主要用于晶圓導電層、阻擋層以及金屬柵極的制作。例如，鋁靶和銅靶常用于制作導電層，而鈦靶和鉭靶則常用于制作阻擋層。這些靶材的純度要求極高，通常在5N（99.999%）以上，以確保薄膜的質量和性能

芯片封裝：在芯片封裝環(huán)節(jié)，靶材用于生成凸點下金屬層、布線層等金屬材料。這些材料對于芯片的電性能和穩(wěn)定性至關重要，因此對靶材的純度和均勻性有嚴格的要求

導線工藝：在半導體芯片的制作中，靶材用于制作傳遞信息的金屬導線。這些導線通過特殊的加工工藝，將沉積在芯片表面的金屬薄膜刻蝕成納米級別的金屬線，連接芯片內部的微型晶體管，實現(xiàn)信號傳遞

高介電常數(shù)的介質金屬柵極技術：鈦材料作為高介電常數(shù)的介質金屬柵極技術的主要材料，這是在芯片制造中用于提高性能和降低功耗的關鍵技術

晶圓接合焊盤工藝：鋁材料在晶圓接合焊盤工藝中作為主要材料，這是在芯片封裝過程中重要的一步，用于確保芯片與外部電路的連接

TMPU-1002

This is a high-purity titanium dioxide (TiO2) material, mainly used for deposition thin films, especially in semiconductor manufacturing, optical devices and magnetic devices have a wide range of applications. The product has the characteristics of high purity, good uniformity and long service life.

The application of magnetron sputtering target materials in semiconductor manufacturing mainly includes the following aspects:

Wafer manufacturing: The target material is mainly used in the wafer manufacturing process for the production of conductive layer, barrier layer and metal gate. For example, aluminum and copper targets are often used to make conductive layers, while titanium and tantalum targets are often used to make barrier layers. The purity of these targets is extremely high, usually above 5N (99.999%), to ensure the quality and performance of the film

Chip packaging: In the chip packaging link, the target is used to generate metal layers under the convex points, wiring layers and other metal materials. These materials are critical to the electrical properties and stability of the chip, so there are strict requirements for the purity and uniformity of the target

Wire process: In the manufacture of semiconductor chips, the target material is used to make metal wires that transmit information. These wires, through a special processing process, etch the metal film deposited on the surface of the chip into nanoscale metal wires, which connect the micro transistors inside the chip to achieve signal transmission

Dielectric metal gate technology with high dielectric constant: Titanium material is the main material of dielectric metal gate technology with high dielectric constant, which is the key technology used to improve performance and reduce power consumption in chip manufacturing

Wafer bonding pad process: Aluminum is used as the main material in the wafer bonding pad process, which is an important step in the chip packaging process to ensure that the chip is connected to the external circuit

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